Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5674780 | Method of forming an electrically conductive polymer bump over an aluminum electrode | William H. Lytle, Treliant Fang, Jong-Kai Lin, Naresh Saha | 1997-10-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5674780 | Method of forming an electrically conductive polymer bump over an aluminum electrode | William H. Lytle, Treliant Fang, Jong-Kai Lin, Naresh Saha | 1997-10-07 |