Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5674780 | Method of forming an electrically conductive polymer bump over an aluminum electrode | Treliant Fang, Jong-Kai Lin, Ravinder K. Sharma, Naresh Saha | 1997-10-07 |
| 5593903 | Method of forming contact pads for wafer level testing and burn-in of semiconductor dice | William M. Beckenbaugh, Bernard H. Berman | 1997-01-14 |