Issued Patents 1997
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5674780 | Method of forming an electrically conductive polymer bump over an aluminum electrode | William H. Lytle, Treliant Fang, Jong-Kai Lin, Ravinder K. Sharma | 1997-10-07 |
NS
Naresh Saha
Overall (1997): #99,662 of 185,788Top 55%
1
Patents 1997