Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5661042 | Process for electrically connecting electrical devices using a conductive anisotropic material | Treliant Fang, Lih-Tyng Hwang | 1997-08-26 |
| 5629630 | Semiconductor wafer contact system and method for contacting a semiconductor wafer | Patrick Francis Thompson, Scott E. Lindsey, Barbara Vasquez | 1997-05-13 |
| 5602491 | Integrated circuit testing board having constrained thermal expansion characteristics | Barbara Vasquez, John W. Stafford | 1997-02-11 |