Issued Patents 1997
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5686761 | Production worthy interconnect process for deep sub-half micrometer back-end-of-line technology | Christy Mei-Chu Woo | 1997-11-11 |
| 5674781 | Landing pad technology doubled up as a local interconnect and borderless contact for deep sub-half micrometer IC application | Robin Cheung, Rajat Rakkhit, Raymond T. Lee | 1997-10-07 |
| 5670828 | Tunneling technology for reducing intra-conductive layer capacitance | Robin Cheung, Simon S. Chan | 1997-09-23 |
| 5654589 | Landing pad technology doubled up as local interconnect and borderless contact for deep sub-half micrometer IC application | Robin Cheung, Rajat Rakkhit, Raymond T. Lee | 1997-08-05 |
| 5635423 | Simplified dual damascene process for multi-level metallization and interconnection structure | Angela T. Hui, Robin Cheung, Mark S. Chang, Ming-Ren Lin | 1997-06-03 |
| 5625231 | Low cost solution to high aspect ratio contact/via adhesion layer application for deep sub-half micrometer back-end-of line technology | Robin Cheung | 1997-04-29 |