Issued Patents 1997
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5674781 | Landing pad technology doubled up as a local interconnect and borderless contact for deep sub-half micrometer IC application | Richard J. Huang, Robin Cheung, Rajat Rakkhit | 1997-10-07 |
| 5654589 | Landing pad technology doubled up as local interconnect and borderless contact for deep sub-half micrometer IC application | Richard J. Huang, Robin Cheung, Rajat Rakkhit | 1997-08-05 |
| 5627110 | Method for eliminating window mask process in the fabrication of a semiconductor wafer when chemical-mechanical polish planarization is used | Richard K. Klein | 1997-05-06 |