Issued Patents 1997
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5674781 | Landing pad technology doubled up as a local interconnect and borderless contact for deep sub-half micrometer IC application | Richard J. Huang, Robin Cheung, Raymond T. Lee | 1997-10-07 |
| 5654589 | Landing pad technology doubled up as local interconnect and borderless contact for deep sub-half micrometer IC application | Richard J. Huang, Robin Cheung, Raymond T. Lee | 1997-08-05 |