Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5670419 | Method of fabricating antifuses in an integrated circuit device and resulting structure | Pankaj Dixit, William P. Ingram, III, Monta R. Holzworth | 1997-09-23 |
| 5646448 | Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device | Darrell M. Erb, Steven C. Avanzino, Robin Cheung, Scott Luning, Bryan Tracy +2 more | 1997-07-08 |
| 5639691 | Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device | Darrell M. Erb, Steven C. Avanzino, Robin Cheung, Scott Luning, Bryan Tracy +2 more | 1997-06-17 |
| 5627110 | Method for eliminating window mask process in the fabrication of a semiconductor wafer when chemical-mechanical polish planarization is used | Raymond T. Lee | 1997-05-06 |