Issued Patents 1997
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5691573 | Composite insulation with a dielectric constant of less than 3 in a narrow space separating conductive lines | Darrell M. Erb, Robin Cheung, Rich Klein | 1997-11-25 |
| 5691238 | Subtractive dual damascene | Subhash Gupta, Rich Klein, Scott Luning, Ming-Ren Lin | 1997-11-25 |
| 5686354 | Dual damascene with a protective mask for via etching | Subhash Gupta, Rich Klein, Scott Luning, Ming-Ren Lin | 1997-11-11 |
| 5665199 | Methodology for developing product-specific interlayer dielectric polish processes | Kashmir Sahota | 1997-09-09 |
| 5662769 | Chemical solutions for removing metal-compound contaminants from wafers after CMP and the method of wafer cleaning | Diana M. Schonauer | 1997-09-02 |
| 5646448 | Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device | Richard K. Klein, Darrell M. Erb, Robin Cheung, Scott Luning, Bryan Tracy +2 more | 1997-07-08 |
| 5639691 | Copper pellet for reducing electromigration effects associated with a conductive via in a semiconductor device | Richard K. Klein, Darrell M. Erb, Robin Cheung, Scott Luning, Bryan Tracy +2 more | 1997-06-17 |
| 5614765 | Self aligned via dual damascene | Subhash Gupta, Rich Klein, Scott Luning, Ming-Ren Lin | 1997-03-25 |