Issued Patents 1997
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5688717 | Construction that prevents the undercut of interconnect lines in plasma metal etch systems | Lewis Shen, Sheshadri Ramaswami, Robin Cheung | 1997-11-18 |
| 5679608 | Processing techniques for achieving production-worthy, low dielectric, low dielectric, low interconnect resistance and high performance IC | Robin Cheung | 1997-10-21 |
| 5675186 | Construction that prevents the undercut of interconnect lines in plasma metal etch systems | Lewis Shen, Sheshadri Ramaswami, Robin Cheung | 1997-10-07 |
| 5635423 | Simplified dual damascene process for multi-level metallization and interconnection structure | Richard J. Huang, Angela T. Hui, Robin Cheung, Ming-Ren Lin | 1997-06-03 |