Issued Patents 1997
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5702564 | Method of etching conductive lines without undercutting | — | 1997-12-30 |
| 5688717 | Construction that prevents the undercut of interconnect lines in plasma metal etch systems | Sheshadri Ramaswami, Mark S. Chang, Robin Cheung | 1997-11-18 |
| 5675186 | Construction that prevents the undercut of interconnect lines in plasma metal etch systems | Sheshadri Ramaswami, Mark S. Chang, Robin Cheung | 1997-10-07 |
| 5665641 | Method to prevent formation of defects during multilayer interconnect processing | Robin Cheung | 1997-09-09 |
| 5604381 | Semiconductor device and method of manufacturing without undercutting conductive lines | — | 1997-02-18 |