Issued Patents 1994
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5365402 | Cooling apparatus of electronic device | Shigeo Ohashi, Tadakatsu Nakajima, Heikichi Kuwahara, Hitoshi Matsushima, Motohiro Sato +5 more | 1994-11-15 |
| 5360060 | Fin-tube type heat exchanger | Takeo Tanaka, Masaaki Itoh, Takao Senshu, Naoto Katsumata, Yoshihiko MOCHIZUKI +5 more | 1994-11-01 |
| 5361188 | Cooling apparatus of electronic equipment | Yoshihiro Kondou, Hitoshi Matsushima, Hiroshi Inouye, Toshihiro Komatsu, Takao Ohba +1 more | 1994-11-01 |
| 5358032 | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted | Masatsugu Arai, Akiomi Kohno, Yoshihiro Kondo, Toshihiro Komatsu, Kanji Otsuka +2 more | 1994-10-25 |
| 5353866 | Heat transfer fins and heat exchanger | Hironobu Ueda, Yoshifumi Kunugi, Tomihisa Oouchi, Sigeo Sugimoto, Tamio Shimizu +1 more | 1994-10-11 |
| 5315482 | Semiconductor apparatus of module installing type | Akira Tanaka, Hiroichi Shinohara, Kazuji Yamada, Takao Ohba, Akira Yamagiwa +4 more | 1994-05-24 |
| 5313362 | Packaging structure of small-sized computer | Hiroshi Inouye, Takao Ohba, Susumu Iwai | 1994-05-17 |