Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5358032 | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted | Masatsugu Arai, Akiomi Kohno, Toshio Hatada, Yoshihiro Kondo, Toshihiro Komatsu +2 more | 1994-10-25 |
| 5313362 | Packaging structure of small-sized computer | Toshio Hatada, Hiroshi Inouye, Takao Ohba | 1994-05-17 |