Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5358032 | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted | Masatsugu Arai, Akiomi Kohno, Toshio Hatada, Toshihiro Komatsu, Kanji Otsuka +2 more | 1994-10-25 |