Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5365402 | Cooling apparatus of electronic device | Toshio Hatada, Shigeo Ohashi, Tadakatsu Nakajima, Heikichi Kuwahara, Hitoshi Matsushima +5 more | 1994-11-15 |
| 5358032 | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted | Masatsugu Arai, Akiomi Kohno, Toshio Hatada, Yoshihiro Kondo, Toshihiro Komatsu +2 more | 1994-10-25 |
| 5309011 | Wafer scale or full wafer memory system, packaging method thereof, and wafer processing method employed therein | Masanori Tazunoki, Hiromitsu Mishimagi, Makoto Homma, Toshiyuki Sakuta, Hisashi Nakamura +8 more | 1994-05-03 |
| 5304844 | Semiconductor device and method of producing the same | Osamu Horiuchi, Gen Murakami, Hiromichi Suzuki, Hajime Hasebe, Yuuji Shirai +2 more | 1994-04-19 |