Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5358032 | LSI package cooling heat sink, method of manufacturing the same and LSI package to which the heat sink is mounted | Akiomi Kohno, Toshio Hatada, Yoshihiro Kondo, Toshihiro Komatsu, Kanji Otsuka +2 more | 1994-10-25 |
| 5307687 | Electromagnetic flowmeter | Akiomi Kohno, Kazuaki Yokoi, Yuuji Yoshitomi, Yutaka Sakurai, Tamio Ishihara | 1994-05-03 |