Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5366906 | Wafer level integration and testing | Robert J. Wojnarowski, Constantine A. Neugebauer, Wolfgang Daum, Bernard Gorowitz, Eric J. Wildi +2 more | 1994-11-22 |
| 5279706 | Method and apparatus for fabricating a metal interconnection pattern for an integrated circuit module | Ernest Wayne Balch, William H. King, Bernard Gorowitz | 1994-01-18 |