Issued Patents All Time
Showing 51–75 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10660127 | Method and apparatus for determining LBT mode and method for LBT mode switching | Wei Gou, Focai Peng, Feng Bi, Yajun Zhao | 2020-05-19 |
| 10536973 | Preamble transmission method and apparatus | Wei Gou, Yajun Zhao, Focai Peng, Feng Bi, Xincai Li | 2020-01-14 |
| 10497652 | Semiconductor substrate and semiconductor device | Tuung Luoh, Ta-Hung Yang, Kuang-Chao Chen | 2019-12-03 |
| 10455504 | Data transmission method and device, base station and user equipment | Xincai Li, Wei Gou, Feng Bi, Focai Peng | 2019-10-22 |
| 10388664 | Integrated circuit device with layered trench conductors | Yukai Huang, Chun-Ling Chiang, Yung-Tai Hung, Chun-Min Cheng, Tuung Luoh +2 more | 2019-08-20 |
| 10354924 | Semiconductor memory device and method of manufacturing the same | Jeng-Hwa Liao, Zong-Jie Ko, Jung-Yu Shieh | 2019-07-16 |
| 10309000 | Method for preparing aluminum-copper-iron quasicrystal and silicon carbide mixed reinforced aluminum matrix composite | Yuhong Zhao, Fenghao Zhang, Hua Hou, Jinzhong Tian, Yuchun Jin | 2019-06-04 |
| 10181484 | TFT substrate manufacturing method and TFT substrate | Haijie Zhang, Zhandong Zhang | 2019-01-15 |
| 9869712 | Method and system for detecting defects of wafer by wafer sort | Tuung Luoh, I-Jen Huang, Ta-Hone Yang, Kuang-Chao Chen | 2018-01-16 |
| 9870982 | Distributed on-chip decoupling apparatus and method using package interconnect | David A. Secker, Chanh Tran, Ying Ji | 2018-01-16 |
| 9589086 | Method for measuring and analyzing surface structure of chip or wafer | Tuung Luoh, Hsiang-Chou Liao, Ta-Hone Yang, Kuang-Chao Chen | 2017-03-07 |
| 9466568 | Distributed on-chip decoupling apparatus and method using package interconnect | David A. Secker, Chanh Tran, Ying Ji | 2016-10-11 |
| 9244112 | Method for detecting an electrical defect of contact/via plugs | Hsiang-Chou Liao, Tuung Luoh, Ta-Hone Yang, Kuang-Chao Chen | 2016-01-26 |
| 9236497 | Methods for fabricating semiconductor device | Jeng-Hwa Liao, Jung-Yu Shieh | 2016-01-12 |
| 9116108 | Electron beam inspection optimization | Tuung Luoh, Ta-Hone Yang, Kuang-Chao Chen | 2015-08-25 |
| 9009561 | System and method for detecting errors in audio data | Mark Pereira, Govendra Gupta | 2015-04-14 |
| 9006003 | Method of detecting bitmap failure associated with physical coordinate | Tuung Luoh, Chi-Min Chen, Ta-Hone Yang, Kuang-Chao Chen | 2015-04-14 |
| 9006907 | Distributed on-chip decoupling apparatus and method using package interconnect | David A. Secker, Chanh Tran, Ying Ji | 2015-04-14 |
| 8938661 | System and method for detecting errors in audio data | Mark Pereira, Govendra Gupta | 2015-01-20 |
| 8735958 | Multi-layer polysilicon suppression of implant species penetration | Chun-Ling Chiang, Wen-Ming Chang, Chun-Ming Cheng, Kuang-Chao Chen | 2014-05-27 |
| 8594963 | In-line inspection yield prediction system | Hsiang-Chou Liao, Che-Lun Hung, Tuung Luoh, Ta-Hone Yang, Kuang-Chao Chen | 2013-11-26 |
| 8581322 | Nonvolatile memory device and method for making the same | Chi-Pin Lu, Jung-Yu Hsieh | 2013-11-12 |
| 8525198 | Ultraviolet light emitting diode devices and methods for fabricating the same | Yue Hao, Xiaohua Ma, Xiaowei Zhou, Peixian Li | 2013-09-03 |
| 8169835 | Charge trapping memory cell having bandgap engineered tunneling structure with oxynitride isolation layer | Jeng-Hwa Liao, Jung-Yu Shieh | 2012-05-01 |
| 7951707 | Etching method for semiconductor element | Tuung Luoh, Kuang-Chao Chen | 2011-05-31 |