CL

Chiung C. Lo

XL Xmems Labs: 29 patents #2 of 28Top 8%
RT Richtek Technology: 6 patents #80 of 459Top 20%
MP Maxim Integrated Products: 5 patents #157 of 945Top 20%
IN Invensense: 4 patents #119 of 391Top 35%
CU Carnegie Mellon University: 1 patents #637 of 1,507Top 45%
📍 San Jose, CA: #1,113 of 32,062 inventorsTop 4%
🗺 California: #9,121 of 386,348 inventorsTop 3%
Overall (All Time): #61,362 of 4,157,543Top 2%
46
Patents All Time

Issued Patents All Time

Showing 26–46 of 46 patents

Patent #TitleCo-InventorsDate
10771891 Method for manufacturing air pulse generating element David Hong, Chun-I Chang 2020-09-08
10609474 Air pulse generating element and manufacturing method thereof Jemm Yue Liang, Wen-Chien Chen, Chun-I Chang 2020-03-31
10477300 Air pulse generating element and sound producing device David Hong, Jemm Yue Liang 2019-11-12
10425732 Sound producing device Jemm Yue Liang 2019-09-24
10327060 Air pulse generating element and sound producing device David Hong, Jemm Yue Liang 2019-06-18
9702889 Micro-electro-mechanical system (MEMS) device Shih-Chieh Lin 2017-07-11
9624090 Mirco-electro-mechanical system device Chia-Yu Wu 2017-04-18
9562926 Micro-electro-mechanical system (MEMS) device including an internal anchor area Chiung-Wen Lin, Yu-Fu Kang 2017-02-07
9362257 Mirco-electro-mechanical system module and manufacturing method thereof Yu-Fu Kang, Ning Wang, Chiung-Wen Lin 2016-06-07
9206032 Micro-electro-mechanical system (MEMS) chip Yu-Fu Kang 2015-12-08
9159684 Wafer-level packaged device having self-assembled resilient leads Arkadii V. Samoilov, Reynante Tamunan Alvarado 2015-10-13
9073750 Manufacturing method of micro-electro-mechanical system device and micro-electro-mechanical system device made thereby Kuan-Lin Chen 2015-07-07
8947081 Micromachined resonant magnetic field sensors Joseph Seeger, Baris Cagdaser, Derek K. Shaeffer 2015-02-03
8860409 Micromachined resonant magnetic field sensors Joseph Seeger, Baris Cagdaser, Derek K. Shaeffer 2014-10-14
8692367 Wafer-level packaged device having self-assembled resilient leads Arkadii V. Samoilov, Reynante Tamunan Alvarado 2014-04-08
8686560 Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress Pirooz Parvarandeh, Reynante Tamunan Alvarado, Arkadii V. Samoilov 2014-04-01
8567246 Integrated MEMS device and method of use Derek K. Shaeffer, Baris Cagdaser, Joseph Seeger 2013-10-29
8410562 Methods, apparatuses, and systems for micromechanical gas chemical sensing capacitor Nathan S. Lazarus, Gary K. Fedder, Sarah S. Bedair 2013-04-02
8405115 Light sensor using wafer-level packaging Arkadii V. Samoilov, Albert Bergemont, Prashanth S. Holenarsipur, James Patrick Long 2013-03-26
8395381 Micromachined magnetic field sensors Joseph Seeger, Martin Lim 2013-03-12
8278748 Wafer-level packaged device having self-assembled resilient leads Arkadii V. Samoilov, Reynante Tamunan Alvarado 2012-10-02