| 6651891 |
Method for producing contactless chip cards and corresponding contactless chip card |
Elke Zakel, Frank Ansorge, Paul Kasulke |
2003-11-25 |
| 6407457 |
Contact-bumpless chip contacting method and an electronic circuit produced by said method |
Elke Zakel, Hans-Hermann Oppermann, Ghassem Azdasht |
2002-06-18 |
| 6284639 |
Method for forming a structured metallization on a semiconductor wafer |
Ghassem Azdasht, Elke Zakel, Andreas Ostmann, Gerald Motulla |
2001-09-04 |
| 6277660 |
Method and apparatus for testing chips |
Elke Zakel, Frank Ansorge, Paul Kasulke, Andreas Ostmann, Lothar Dietrich |
2001-08-21 |
| 6211571 |
Method and apparatus for testing chips |
Elke Zakel, Frank Ansorge, Paul Kasulke, Andreas Ostmann, Lothar Dietrich |
2001-04-03 |
| 6107118 |
Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way |
Elke Zakel, Hans-Hermann Oppermann, Ghassem Azdasht |
2000-08-22 |
| 5989993 |
Method for galvanic forming of bonding pads |
Elke Zakel, Andreas Ostmann, Paul Kasulke |
1999-11-23 |
| 5928458 |
Flip chip bonding with non conductive adhesive |
Jorg Gwiasda, Elke Zakel, Joachim Eldring |
1999-07-27 |
| 5906312 |
Solder bump for flip chip assembly and method of its fabrication |
Elke Zakel |
1999-05-25 |
