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Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
RA

Rolf Aschenbrenner — 9 Patents

UNUnknown: 3 patents #7,366 of 83,584Top 9%
Fraunhofer: 2 patents #1,111 of 4,748Top 25%
SSSmart Pac Gmbh Technology Services: 2 patents #3 of 10Top 30%
PGPac Tech—Packaging Technologies Gmbh: 1 patents #15 of 26Top 60%
Berlin, DE: #779 of 9,690 inventorsTop 9%
Overall (All Time): #535,341 of 4,157,543Top 15%
9 Patents All Time
Rolf Aschenbrenner has been granted 9 US patents while listed as an inventor at Unknown. The first was granted in 1999 and the most recent in November 2003. Rolf Aschenbrenner ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Rolf Aschenbrenner in Berlin, DE.

Patents per Year

Patents granted per year, 1999 to 2003Bar chart with a peak of 3 patents in 1999.peak 31999: 3 patents19992000: 1 patents20002001: 3 patents20012002: 1 patents20022003: 1 patents2003

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
6651891 Method for producing contactless chip cards and corresponding contactless chip card Elke Zakel, Frank Ansorge, Paul Kasulke 2003-11-25
6407457 Contact-bumpless chip contacting method and an electronic circuit produced by said method Elke Zakel, Hans-Hermann Oppermann, Ghassem Azdasht 2002-06-18
6284639 Method for forming a structured metallization on a semiconductor wafer Ghassem Azdasht, Elke Zakel, Andreas Ostmann, Gerald Motulla 2001-09-04
6277660 Method and apparatus for testing chips Elke Zakel, Frank Ansorge, Paul Kasulke, Andreas Ostmann, Lothar Dietrich 2001-08-21
6211571 Method and apparatus for testing chips Elke Zakel, Frank Ansorge, Paul Kasulke, Andreas Ostmann, Lothar Dietrich 2001-04-03
6107118 Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way Elke Zakel, Hans-Hermann Oppermann, Ghassem Azdasht 2000-08-22
5989993 Method for galvanic forming of bonding pads Elke Zakel, Andreas Ostmann, Paul Kasulke 1999-11-23
5928458 Flip chip bonding with non conductive adhesive Jorg Gwiasda, Elke Zakel, Joachim Eldring 1999-07-27
5906312 Solder bump for flip chip assembly and method of its fabrication Elke Zakel 1999-05-25