Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5956232 | Chip support arrangement and chip support for the manufacture of a chip casing | Elke Zakel, David Gu Lin, Andreas Ostmann | 1999-09-21 |
| 5928458 | Flip chip bonding with non conductive adhesive | Rolf Aschenbrenner, Elke Zakel, Joachim Eldring | 1999-07-27 |
| 5845838 | Process for remelting a contact surface metallization | Elke Zakel, Hans-Hermann Oppermann, Achim Kloeser, Stefan Weiss | 1998-12-08 |