AO

Andreas Ostmann

Fraunhofer: 9 patents #277 of 4,748Top 6%
TB Technische Universität Berlin: 2 patents #32 of 324Top 10%
PG Pac Tech—Packaging Technologies Gmbh: 1 patents #15 of 26Top 60%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
Overall (All Time): #371,355 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
11563266 Module arrangement comprising an integrated antenna and embedded components and method for manufacturing a module arrangement Ivan Ndip 2023-01-24
11394109 Module arrangement comprising embedded components and an integrated antenna, device comprising module arrangements, and method for manufacturing Ivan Ndip 2022-07-19
9243341 Device and method for producing targeted flow and current density patterns in a chemical and/or electrolytic surface treatment Lothar Dietrich, Ralf Schmidt 2016-01-26
8975116 Electronic assembly including an embedded electronic component Dionysios Manessis, Lars Böttcher, Stefan Karaszkiewicz 2015-03-10
8861220 Method for generating an electronic system, method for generating a freeform surface having such a system, and electronic system and freeform surfaces having such a system Thomas Löher, Manuel Seckel 2014-10-14
8654536 Expandable circuit carrier Manuel Seckel, Thomas Löher, Dionysios Manessis, Rainer Patzelt 2014-02-18
8042724 Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate Alexander Neumann, Dionysios Manessis, Rainer Patzelt 2011-10-25
7011989 Method for producing encapsulated chips Karl-Friedrich Becker, Tanja Braun, Mathias Koch, Lars Böttcher, Erik Jung 2006-03-14
6284639 Method for forming a structured metallization on a semiconductor wafer Rolf Aschenbrenner, Ghassem Azdasht, Elke Zakel, Gerald Motulla 2001-09-04
6277660 Method and apparatus for testing chips Elke Zakel, Frank Ansorge, Paul Kasulke, Rolf Aschenbrenner, Lothar Dietrich 2001-08-21
6211571 Method and apparatus for testing chips Elke Zakel, Frank Ansorge, Paul Kasulke, Rolf Aschenbrenner, Lothar Dietrich 2001-04-03
5989993 Method for galvanic forming of bonding pads Elke Zakel, Rolf Aschenbrenner, Paul Kasulke 1999-11-23
5956232 Chip support arrangement and chip support for the manufacture of a chip casing Elke Zakel, David Gu Lin, Jorg Gwiasda 1999-09-21