Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11563266 | Module arrangement comprising an integrated antenna and embedded components and method for manufacturing a module arrangement | Andreas Ostmann | 2023-01-24 |
| 11394109 | Module arrangement comprising embedded components and an integrated antenna, device comprising module arrangements, and method for manufacturing | Andreas Ostmann | 2022-07-19 |
| 11328987 | Waver-level packaging based module and method for producing the same | Tanja Braun, Klaus-Dieter Lang | 2022-05-10 |
| 11330699 | Non-overlapping power/ground planes for localized power distribution network design | Arif Ege Engin, Gerardo Aguirre, Klaus-Dieter Lang | 2022-05-10 |
| 11283166 | Module unit having integrated antennas | Kai Zoschke, Klaus-Dieter Lang | 2022-03-22 |
| 11271297 | Three-dimensional antenna device | Christine Kallmayer, Klaus-Dieter Lang | 2022-03-08 |
| 11177569 | Three-dimensional loop antenna device | Christine Kallmayer, Klaus-Dieter Lang | 2021-11-16 |
| 11114752 | Three-dimensional antenna apparatus having at least one additional radiator | Christine Kallmayer, Klaus-Dieter Lang | 2021-09-07 |
| 10978778 | Wafer level package with integrated antennas and means for shielding | Tanja Braun | 2021-04-13 |
| 10903560 | Hermetically sealed module unit with integrated antennas | Thomas Loeher, Klaus-Dieter Lang | 2021-01-26 |
| 10797375 | Wafer level package with at least one integrated antenna element | Tanja Braun | 2020-10-06 |
| 10727594 | Ndip antenna | — | 2020-07-28 |
| 10566679 | Ribbon bond antennas | — | 2020-02-18 |
| 10490524 | Antenna apparatus having bond wires | — | 2019-11-26 |
| 10461399 | Wafer level package with integrated or embedded antenna | Tanja Braun | 2019-10-29 |
| 10151783 | Antenna measuring station | Volker Grosser, Christian Tschoban, Brian Curran, Max Huhn, Klaus-Dieter Lang | 2018-12-11 |