Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327751 | Massive parallel assembly method | Hans-Hermann Oppermann, Charles-Alix Manier | 2025-06-10 |
| 12273993 | Method for producing a carrier arrangement | Mathias Bottcher, Frank Windrich, M. Jürgen Wolf | 2025-04-08 |
| 11385404 | Markup system for optical system, carrier substrate, and method for manufacturing of same | Charles-Alix Manier, Hans-Hermann Oppermann, Tolga Tekin | 2022-07-12 |
| 11283166 | Module unit having integrated antennas | Ivan Ndip, Klaus-Dieter Lang | 2022-03-22 |
| 10658187 | Method for manufacturing a semiconductor component and a semiconductor component | Hans-Hermann Oppermann, Charles-Alix Manier, Martin Wilke, Tolga Tekin, Robert Gernhardt | 2020-05-19 |
| 10134707 | Bonding method for connecting two wafers | Michael Töpper | 2018-11-20 |
| 10074608 | Method for manufacturing a contact bump by thermal expansion of a patterned sacrificial layer underneath a galvanic layer | Martin Wilke, Markus Wöhrmann, Thomas Fritzsch, Hermann Oppermann, Oswin Ehrmann | 2018-09-11 |
| 9917070 | Method for arranging electronic switching elements, electronic switching arrangement and use of a carrier having a bonding layer | Hans-Hermann Oppermann, Lena Goullon | 2018-03-13 |