Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327751 | Massive parallel assembly method | Kai Zoschke, Charles-Alix Manier | 2025-06-10 |
| 11726263 | Optical system, optical components, and method for manufacturing an optical system | Tolga Tekin, Charles-Alix Manier | 2023-08-15 |
| 11402583 | Assembly comprising a substrate and two components including optical waveguides, as well as method for production | Tolga Tekin, Jörg Stockmeyer, Juliane Fröhlich | 2022-08-02 |
| 11385404 | Markup system for optical system, carrier substrate, and method for manufacturing of same | Charles-Alix Manier, Kai Zoschke, Tolga Tekin | 2022-07-12 |
| 10658187 | Method for manufacturing a semiconductor component and a semiconductor component | Kai Zoschke, Charles-Alix Manier, Martin Wilke, Tolga Tekin, Robert Gernhardt | 2020-05-19 |
| 9917070 | Method for arranging electronic switching elements, electronic switching arrangement and use of a carrier having a bonding layer | Kai Zoschke, Lena Goullon | 2018-03-13 |
| 9507107 | Arrangement of a substrate with at least one optical waveguide and with an optical coupling location and of an optoelectronic component, and method for manufacturing such an arrangement | — | 2016-11-29 |
| 9134483 | Optical coupling system having an optical coupler and a light-transmissive external medium and also production and use of such a system | — | 2015-09-15 |
| 8564969 | Component arrangement and method for production thereof | Matthias Klein, Michael Toepper, Juergen Wolf | 2013-10-22 |
| 8521303 | In vivo implantable coil assembly | Florian Solzbacher, Reid Harrison, Richard A. Normann, Sohee KIM, Michael Töpper +2 more | 2013-08-27 |
| 7861914 | Self-assembly of components | — | 2011-01-04 |
| 7388288 | Flip chip metallization method and devices | Florian Solzbacher, Reid Harrison, Richard A. Normann, Lothar Dietrich, Matthias Klein +1 more | 2008-06-17 |
| 7087442 | Process for the formation of a spatial chip arrangement and spatial chip arrangement | Elke Zakel, Ghassem Azdasht, Paul Kasulke | 2006-08-08 |
| 6407457 | Contact-bumpless chip contacting method and an electronic circuit produced by said method | Rolf Aschenbrenner, Elke Zakel, Ghassem Azdasht | 2002-06-18 |
| 6281577 | Chips arranged in plurality of planes and electrically connected to one another | Elke Zakel, Ghassem Azdasht, Paul Kasulke | 2001-08-28 |
| 6107118 | Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way | Rolf Aschenbrenner, Elke Zakel, Ghassem Azdasht | 2000-08-22 |
| 6093971 | Chip module with conductor paths on the chip bonding side of a chip carrier | Elke Zakel, Ghassem Azdasht, Paul Kasulke | 2000-07-25 |
| 5976302 | Method of joining electronic components to a substrate | Elke Zakel, Christine Kallmayer, Achim Kloeser | 1999-11-02 |
| 5845838 | Process for remelting a contact surface metallization | Jorg Gwiasda, Elke Zakel, Achim Kloeser, Stefan Weiss | 1998-12-08 |