MT

Michael Töpper

Fraunhofer: 4 patents #609 of 4,748Top 15%
UU University Of Utah: 2 patents #446 of 1,848Top 25%
TB Technische Universität Berlin: 1 patents #74 of 324Top 25%
Overall (All Time): #914,884 of 4,157,543Top 25%
5
Patents All Time

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #TitleCo-InventorsDate
12358826 Method of joining glass elements with material continuity, glass component, and housing, and vacuum insulating glass panel comprising the glass component Philipp Wachholz, Norbert Arndt-Staufenbiel, Julian Schwietering 2025-07-15
10403576 Method for manufacturing an electronic component and an electronic component Tanja Braun, Karl-Friedrich Becker, Ruben Kahle 2019-09-03
10134707 Bonding method for connecting two wafers Kai Zoschke 2018-11-20
8521303 In vivo implantable coil assembly Florian Solzbacher, Reid Harrison, Richard A. Normann, Sohee KIM, Hans-Hermann Oppermann +2 more 2013-08-27
7388288 Flip chip metallization method and devices Florian Solzbacher, Reid Harrison, Richard A. Normann, Hans-Hermann Oppermann, Lothar Dietrich +1 more 2008-06-17