Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11328987 | Waver-level packaging based module and method for producing the same | Ivan Ndip, Klaus-Dieter Lang | 2022-05-10 |
| 10978778 | Wafer level package with integrated antennas and means for shielding | Ivan Ndip | 2021-04-13 |
| 10797375 | Wafer level package with at least one integrated antenna element | Ivan Ndip | 2020-10-06 |
| 10461399 | Wafer level package with integrated or embedded antenna | Ivan Ndip | 2019-10-29 |
| 10403576 | Method for manufacturing an electronic component and an electronic component | Karl-Friedrich Becker, Ruben Kahle, Michael Töpper | 2019-09-03 |
| 7011989 | Method for producing encapsulated chips | Karl-Friedrich Becker, Mathias Koch, Andreas Ostmann, Lars Böttcher, Erik Jung | 2006-03-14 |