Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for forming a structured metallization on a semiconductor wafer

Method for forming a structured metallization on a semiconductor wafer

US Patent 6284639 · Granted Sep 4, 2001

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Solder ball feeding device2023
Module arrangement comprising an integrated antenna and embedded components and 2023
Method and laser arrangement for fusing a solder material deposit by means of la2023
Module arrangement comprising embedded components and an integrated antenna, dev2022
Device for the separate application of solder material deposits2022
Device for the separate application of bonding material deposits2020
Device for removing a test contact of a test contact arrangement2020
Method for producing a chip module2019
Device for the separate application of connecting material deposits2019
Method for forming solder deposits2018
Device for the separate application of solder material deposits2018
Semiconductor chip assembly and method for manufacturing the same2017