Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Device for the separate application of solder material deposits

Device for the separate application of solder material deposits

US Patent 10081068 · Granted Sep 25, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Solder ball feeding device2023
Method and laser arrangement for fusing a solder material deposit by means of la2023
Device for the separate application of solder material deposits2022
Device for the separate application of bonding material deposits2020
Device for removing a test contact of a test contact arrangement2020
Method for producing a chip module2019
Device for the separate application of connecting material deposits2019
Method for forming solder deposits2018
Semiconductor chip assembly and method for manufacturing the same2017
Method and device for electrically contacting terminal faces of two substrates b2017
Method and device for transferring a chip to a contact substrate2016
Method and device for contacting, positioning and impinging a solder ball format2016