Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8546739 | Manufacturing method of wafer level chip scale package of image-sensing module | Min-Chih Hsuan, Tsung-Hsi Ko | 2013-10-01 |
| 8536709 | Wafer with eutectic bonding carrier and method of manufacturing the same | Chang-Sheng Hsu, Kuo-Yuh Yang, Yan-Da Chen, Chia-Wen Lien | 2013-09-17 |
| 8502382 | MEMS and protection structure thereof | Bang-Chiang Lan, Ming-I Wang, Hui-Min Wu, Min Chen, Chien-Hsin Huang +4 more | 2013-08-06 |
| 8405949 | Current sensor for measuring inhomogeneity of potential distribution of arrester | Baoshan Wang, Xi Zhang, Lin Tang, Yi Xiong, Zhongqiu Zuo +1 more | 2013-03-26 |
| 8368153 | Wafer level package of MEMS microphone and manufacturing method thereof | Chien-Hsin Huang, Ming-I Wang, Bang-Chiang Lan, Hui-Min Wu, Tzung-I Su | 2013-02-05 |
| 8363859 | Microelectromechanical system microphone package structure | — | 2013-01-29 |
| 8345895 | Diaphragm of MEMS electroacoustic transducer | — | 2013-01-01 |
| 8208662 | Microelectromechanical system microphone structure and microelectromechanical system microphone package structure | — | 2012-06-26 |
| 8193640 | MEMS and a protection structure thereof | Bang-Chiang Lan, Ming-I Wang, Hui-Min Wu, Min Chen, Chien-Hsin Huang +4 more | 2012-06-05 |
| 7659501 | Image-sensing module of image capture apparatus and manufacturing method thereof | Min-Chih Hsuan, Tsung-Hsi Ko | 2010-02-09 |
| 7368785 | MOS transistor device structure combining Si-trench and field plate structures for high voltage device | Chih-Chong Wang | 2008-05-06 |