Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11976783 | Electronic device and mounting structure thereof | Bing-Sheng Hsieh | 2024-05-07 |
| 11888170 | Clamping member and battery accommodating device | Ying-Yen Lu | 2024-01-30 |
| 11839027 | Electronic device with connector structure | Shih-Hao Ou | 2023-12-05 |
| 11638367 | Electronic device and heat dissipating electromagnetic shielding structure | Chien-Ming Peng, Yu-Jen Liu, Chih-Chuan Lin, Chi-Te Lin | 2023-04-25 |
| 11635166 | Electronic device and mounting structure thereof | Bing-Sheng Hsieh | 2023-04-25 |
| 11442220 | Electronic device and light indicator module thereof | Ying-Yen Lu, Shih-Hao Ou | 2022-09-13 |
| 11378734 | Electronic device and indicator module thereof | Ying-Yen Lu, Tzu-Heng Huang, Jun Wang | 2022-07-05 |
| 11253059 | Cabinet | Chien-Ming Peng | 2022-02-22 |
| 10523598 | Multi-path virtual switching | Yunsong Lu, Wenzhe Zhou | 2019-12-31 |
| 10475640 | Method for manufacturing semiconductor device | Weng-Yi Chen, Chang-Sheng Hsu, Kuan-Yu Wang, Yuan-Sheng Lin | 2019-11-12 |
| 10469374 | Multiple provider framework for virtual switch data planes and data plane migration | Yunsong Lu | 2019-11-05 |
| 10115582 | Semiconductor device and method for manufacturing the same | Weng-Yi Chen, Chang-Sheng Hsu, Kuan-Yu Wang, Yuan-Sheng Lin | 2018-10-30 |
| 9668064 | Microelectromechanical system microphone | Chang-Sheng Hsu, Yuan-Sheng Lin, Wei Fang, Kuan-Yu Wang | 2017-05-30 |
| 8929748 | Tunable dense wavelength division multiplexing transceiver, circuits and devices therefor, and methods for making and using such transceivers, circuits and devices | Zhaoyang Hu, Qing Xiao, Meiling Lu, Thomas Liljeberg | 2015-01-06 |
| 8776363 | Method for supporting semiconductor wafer and wafer supporting assembly | Chang-Sheng Hsu, Li-Che Chen, Kuo-Yuh Yang, Chia-Wen Lien | 2014-07-15 |
| 8754504 | Thinned wafer and fabricating method thereof | Chang-Sheng Hsu, Kuo-Yuh Yang, Kuo-Hsiung Huang, Chia-Wen Lien | 2014-06-17 |
| 8536709 | Wafer with eutectic bonding carrier and method of manufacturing the same | Chang-Sheng Hsu, Kuo-Yuh Yang, Li-Che Chen, Chia-Wen Lien | 2013-09-17 |