YC

Yan-Da Chen

WN Wistron Neweb: 8 patents #50 of 577Top 9%
UM United Microelectronics: 6 patents #927 of 4,560Top 25%
Futurewei Technologies: 2 patents #668 of 1,563Top 45%
SP Source Photonics: 1 patents #22 of 54Top 45%
Overall (All Time): #267,065 of 4,157,543Top 7%
17
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11976783 Electronic device and mounting structure thereof Bing-Sheng Hsieh 2024-05-07
11888170 Clamping member and battery accommodating device Ying-Yen Lu 2024-01-30
11839027 Electronic device with connector structure Shih-Hao Ou 2023-12-05
11638367 Electronic device and heat dissipating electromagnetic shielding structure Chien-Ming Peng, Yu-Jen Liu, Chih-Chuan Lin, Chi-Te Lin 2023-04-25
11635166 Electronic device and mounting structure thereof Bing-Sheng Hsieh 2023-04-25
11442220 Electronic device and light indicator module thereof Ying-Yen Lu, Shih-Hao Ou 2022-09-13
11378734 Electronic device and indicator module thereof Ying-Yen Lu, Tzu-Heng Huang, Jun Wang 2022-07-05
11253059 Cabinet Chien-Ming Peng 2022-02-22
10523598 Multi-path virtual switching Yunsong Lu, Wenzhe Zhou 2019-12-31
10475640 Method for manufacturing semiconductor device Weng-Yi Chen, Chang-Sheng Hsu, Kuan-Yu Wang, Yuan-Sheng Lin 2019-11-12
10469374 Multiple provider framework for virtual switch data planes and data plane migration Yunsong Lu 2019-11-05
10115582 Semiconductor device and method for manufacturing the same Weng-Yi Chen, Chang-Sheng Hsu, Kuan-Yu Wang, Yuan-Sheng Lin 2018-10-30
9668064 Microelectromechanical system microphone Chang-Sheng Hsu, Yuan-Sheng Lin, Wei Fang, Kuan-Yu Wang 2017-05-30
8929748 Tunable dense wavelength division multiplexing transceiver, circuits and devices therefor, and methods for making and using such transceivers, circuits and devices Zhaoyang Hu, Qing Xiao, Meiling Lu, Thomas Liljeberg 2015-01-06
8776363 Method for supporting semiconductor wafer and wafer supporting assembly Chang-Sheng Hsu, Li-Che Chen, Kuo-Yuh Yang, Chia-Wen Lien 2014-07-15
8754504 Thinned wafer and fabricating method thereof Chang-Sheng Hsu, Kuo-Yuh Yang, Kuo-Hsiung Huang, Chia-Wen Lien 2014-06-17
8536709 Wafer with eutectic bonding carrier and method of manufacturing the same Chang-Sheng Hsu, Kuo-Yuh Yang, Li-Che Chen, Chia-Wen Lien 2013-09-17