Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084357 | Method for manufacturing a dual damascene opening comprising a trench opening and a via opening | Wei-Chih Chen, Su-Jen Sung, Chun-Chieh Huang, Mei-Ling Chen, Jiann-Jen Chiou | 2011-12-27 |
| 7514347 | Interconnect structure and fabricating method thereof | Chih-Chien Liu, Chun-Chieh Huang, Jei-Ming Chen, Shu-Jen Sung | 2009-04-07 |
| 7439154 | Method of fabricating interconnect structure | Chih-Chien Liu, Jim-Jey Huang, Jei-Ming Chen | 2008-10-21 |