Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084357 | Method for manufacturing a dual damascene opening comprising a trench opening and a via opening | Wei-Chih Chen, Su-Jen Sung, Feng-Yu Hsu, Chun-Chieh Huang, Mei-Ling Chen | 2011-12-27 |
| 6503837 | Method of rinsing residual etching reactants/products on a semiconductor wafer | — | 2003-01-07 |
| 6387750 | Method of forming MIM capacitor | Erh-Kun Lai, Shou-Wei Hwang, Yu-Ping Huang | 2002-05-14 |