Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7412394 | System and method for founding establishment through internet | John Hsuan | 2008-08-12 |
| 6987057 | Method making bonding pad | Yimin Huang, Tri-Rung Yew | 2006-01-17 |
| 6940146 | Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same | Tsing-Fong Hwang | 2005-09-06 |
| 6914318 | Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same | Tsing-Fong Hwang | 2005-07-05 |
| 6888247 | Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same | Tsing-Fong Hwang | 2005-05-03 |
| 6794752 | Bonding pad structure | Yimin Huang, Tri-Rung Yew | 2004-09-21 |
| 6657283 | Reducing relative stress between HDP layer and passivation layer | Ing-Tang Chen, Horng-Bor Lu | 2003-12-02 |
| 6492256 | Method for forming an interconnect structure with air gap compatible with unlanded vias | Shih-Wei Sun | 2002-12-10 |
| 6492732 | Interconnect structure with air gap compatible with unlanded vias | Shih-Wei Sun | 2002-12-10 |
| 6245635 | Method of fabricating shallow trench isolation | — | 2001-06-12 |
| 6171960 | Method of fabricating copper interconnection | — | 2001-01-09 |
| 5933761 | Dual damascene structure and its manufacturing method | — | 1999-08-03 |
| 4431108 | Clothes hanger support | — | 1984-02-14 |