Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same

Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same

US Patent 6914318 · Granted Jul 5, 2005

Estimated economic value: $1,326,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System and method for founding establishment through internet2008
Method making bonding pad2006
Interconnect structure with an enlarged air gaps disposed between conductive str2005
Interconnect structure with an enlarged air gaps disposed between conductive str2005
Interconnect structure with an enlarged air gaps disposed between conductive str2005
Interconnect structure with an enlarged air gaps disposed between conductive str2005
Bonding pad structure2004
Reducing relative stress between HDP layer and passivation layer2003
Method for forming an interconnect structure with air gap compatible with unland2002
Interconnect structure with air gap compatible with unlanded vias2002
Method for forming metal interconnection structure without corner faceted2002
Method of fabricating shallow trench isolation2001