Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11543112 | Human-factor lamp capable of intelligently adjusting ambient light and system thereof | Yung-Hong Wang, Brian A Cook | 2023-01-03 |
| 11497095 | LED lighting device capable of adjusting color temperature by hardware and software cooperative control to achieve high-performance light output | Yung-Hong Wang, Yun Zhang | 2022-11-08 |
| 11257964 | Sensor package structure | Fu-Chou Liu, LI-CHUN HUNG, Ya-Han Chang | 2022-02-22 |
| 11227885 | Image sensor package with particle blocking dam | LI-CHUN HUNG | 2022-01-18 |
| 11133348 | Sensor package structure and sensing module thereof | LI-CHUN HUNG, Jian-Ru Chen, Chen Peng | 2021-09-28 |
| 10964615 | Chip-scale sensor package structure | LI-CHUN HUNG, Hsiu-Wen Tu | 2021-03-30 |
| 10916511 | Method for reducing warpage occurred to substrate strip after molding process | Fu-Chou Liu, Ya-Han Chang | 2021-02-09 |
| 10868062 | Sensor package structure | Chen Peng, Chien LIN, Jian-Ru Chen | 2020-12-15 |
| 10825851 | Sensor package structure | Sheng-Shu Yang, LI-CHUN HUNG, Hsiu-Wen Tu, Jo-Wei Yang, Jian-Ru Chen | 2020-11-03 |
| 10721800 | LED light panel capable of adjusting color temperature | Yung-Hong Wang, Chuan-Zhu Pan, Qin Zhou | 2020-07-21 |
| 10700111 | Optical sensor | LI-CHUN HUNG, Hsiu-Wen Tu | 2020-06-30 |
| 10106399 | Multi-layer single chip MEMS WLCSP fabrication | Tzu-Feng Chang | 2018-10-23 |
| 9975759 | Method and structure of MEMS PLCSP fabrication | Tzu-Feng Chang | 2018-05-22 |
| 9738510 | Method and structure of MEMS PLCSP fabrication | — | 2017-08-22 |
| 9685402 | Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrate | Jen-Yu Chen, Yi-Wen Huang, Ke Jung Jen | 2017-06-20 |
| 9673093 | Semiconductor device and method of making wafer level chip scale package | Ming-Che Hsieh, Baw-Ching Perng | 2017-06-06 |
| 9540232 | Method and structure of MEMS WLCSP fabrication | — | 2017-01-10 |
| 9478513 | Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate | Jen-Yu Chen, Ting Yu Fu, Men Hsien Li | 2016-10-25 |
| 9349700 | Semiconductor device and method of forming stress-reduced conductive joint structures | Ming-Che Hsieh | 2016-05-24 |
| 9230896 | Semiconductor device and method of reflow soldering for conductive column structure in flip chip package | Li Chiun Hung | 2016-01-05 |
| 9224122 | Outdoor device management system | Yung-Hong Wang | 2015-12-29 |
| 8741764 | Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate | Jen-Yu Chen, Ting Yu Fu, Men Hsien Li | 2014-06-03 |
| 7015591 | Exposed pad module integrating a passive device therein | — | 2006-03-21 |