Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11035741 | Temperature measurement substrate and temperature measurement system | Tadashi MITSUNARI, Satoshi Tanaka, Tsuyoshi Moriya, Toshiya Matsuda, Masaaki Miyagawa | 2021-06-15 |
| 9318387 | Method for separating and transferring IC chips | Masahiro Yamada, Hiroshi Nishikawa | 2016-04-19 |
| 9196539 | Method for separating and transferring IC chips | Masahiro Yamada, Hiroshi Nishikawa | 2015-11-24 |
| 8841141 | Method for separating and transferring IC chips | Masahiro Yamada, Hiroshi Nishikawa | 2014-09-23 |
| 8658436 | Method for separating and transferring IC chips | Masahiro Yamada, Hiroshi Nishikawa | 2014-02-25 |
| 7769617 | Worker management system, worker management apparatus and worker management method | Hiroshi Nishikawa | 2010-08-03 |
| 7682517 | Method of processing substrate, and method of and program for manufacturing electronic device | Eiichi Nishimura | 2010-03-23 |
| 7622392 | Method of processing substrate, method of manufacturing solid-state imaging device, method of manufacturing thin film device, and programs for implementing the methods | Eiichi Nishimura | 2009-11-24 |
| 7510972 | Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device | Eiichi Nishimura | 2009-03-31 |