Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283559 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Huo Yun Duan, Xi Li, Chen Xiong | 2025-04-22 |
| 11515275 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Huo Yun Duan, Xi Li, Chen Xiong | 2022-11-29 |
| 10692835 | Ball bond attachment for a semiconductor die | Han Zhong, Zi Qi Wang, Chen Xiong, Yong Tang, Xi Li | 2020-06-23 |