Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283559 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Huo Yun Duan, Xi Li, Xiao Lin Kang | 2025-04-22 |
| 12108533 | Circuit board and method for manufacturing thereof | Zhi Guo, Po-Yuan Chen | 2024-10-01 |
| 11515275 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Huo Yun Duan, Xi Li, Xiao Lin Kang | 2022-11-29 |
| 10692835 | Ball bond attachment for a semiconductor die | Han Zhong, Zi Qi Wang, Yong Tang, Xi Li, Xiao Lin Kang | 2020-06-23 |
| 10340246 | Wire ball bonding in semiconductor devices | Han Zhong, Yong Tang, Zi Qi Wang, Xi Li | 2019-07-02 |