Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10692835 | Ball bond attachment for a semiconductor die | Zi Qi Wang, Chen Xiong, Yong Tang, Xi Li, Xiao Lin Kang | 2020-06-23 |
| 10340246 | Wire ball bonding in semiconductor devices | Yong Tang, Chen Xiong, Zi Qi Wang, Xi Li | 2019-07-02 |