Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283559 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Xi Li, Chen Xiong, Xiao Lin Kang | 2025-04-22 |
| 11515275 | Copper wire bond on gold bump on semiconductor die bond pad | Lin Zhang, Xi Li, Chen Xiong, Xiao Lin Kang | 2022-11-29 |