LZ

Lin Zhang

NA Nanjing University Of Aeronautics And Astronautics: 2 patents #51 of 440Top 15%
TI Texas Instruments: 2 patents #5,248 of 12,488Top 45%
M( Measurement Specialties (China): 1 patents #17 of 46Top 40%
NU Nanyang Technological University: 1 patents #385 of 1,285Top 30%
HU Hohai University: 1 patents #41 of 267Top 20%
SC Shanghai Neusoft Medical Technology Co.: 1 patents #19 of 48Top 40%
S( Sq Technology (Shanghai): 1 patents #9 of 27Top 35%
University of California: 1 patents #8,022 of 18,278Top 45%
UM United Microelectronics: 1 patents #2,686 of 4,560Top 60%
PL Power China Huadong Engineering Corporation Limited: 1 patents #25 of 105Top 25%
MS Measurement Specialties: 1 patents #43 of 94Top 50%
📍 Shanghai, CA: #370 of 801 inventorsTop 50%
Overall (All Time): #333,198 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDate
12429521 JTAG standard pin test system Qiu-Yue Duan, Xin-Ying Xie 2025-09-30
12383222 Stretchable ultrasonic transducer devices Sheng Xu, Chonghe WANG, Hongjie HU, Xiaoshi Li 2025-08-12
12349636 Method for cultivating tung tree seedling by hypocotyl grafting Ze Li, Yeyao Liu, Hanyu Shu, Haoyu Wang, Renrong Peng +9 more 2025-07-08
12283559 Copper wire bond on gold bump on semiconductor die bond pad Huo Yun Duan, Xi Li, Chen Xiong, Xiao Lin Kang 2025-04-22
12115669 Variable-parameter stiffness identification and modeling method for industrial robot Wei Tian, Jiachen Jiao, Wenhe Liao, Bo Li, Guangyu Cui +1 more 2024-10-15
11647736 Engineered recirculating aquaculture fish pond and fish culture method Gangchun Xu, Hongxia Li, Zhijuan NIE, Quanjie LI, Changyou Song +3 more 2023-05-16
11648604 Robot vision-based automatic rivet placement system and method Wei Tian, Yi Zheng, Zhiwei Zhuang, Wenhe Liao, Bo Li +1 more 2023-05-16
11634986 Supercritical fluid drilling and blasting integrated double-arm drill jumbo and control method thereof Shaobin HU, Yukang Cai, Lingzhi XI, Huai Yang, Zhengyong Yan +3 more 2023-04-25
11515275 Copper wire bond on gold bump on semiconductor die bond pad Huo Yun Duan, Xi Li, Chen Xiong, Xiao Lin Kang 2022-11-29
11070008 Sensor with circuit protection module Jun Li, Natasha V. Kachenko, Vincent Wong, Tuyen Nguyen 2021-07-20
10737120 Detecting consistency between radiation field and light field Han Xu, Zhichao Jiang, Ming Li 2020-08-11
10598853 Optical structure and method of forming the same Chuan Seng Tan, Wei LI, P Anantha, Kwang Hong Lee, Shuyu Bao 2020-03-24
9903835 Fully automated high-precision capillary electrophoresis instrument Chao Yan, Dong Dong Yao, Jing Li 2018-02-27
6507060 Silicon-based PT/PZT/PT sandwich structure and method for manufacturing the same Tian Ren, Li Liu, Zhi-Jian Li 2003-01-14