| 12159846 |
Process flow for fabrication of cap metal over top metal with sinter before protective dielectric etch |
Richard Allen Faust, Robert M. Higgins, Anagha Kulkarni, Sudtida Lavangkul, Andrew Frank Burnett |
2024-12-03 |
| 11916067 |
High reliability polysilicon components |
Robert M. Higgins, Henry Litzmann Edwards, Xiaoju Wu, Shariq Arshad, Li Wang +1 more |
2024-02-27 |
| 11908729 |
Selective etches for reducing cone formation in shallow trench isolations |
Karen Hildegard Ralston Kirmse |
2024-02-20 |
| 11742208 |
Method of reducing voids and seams in trench structures by forming semi-amorphous polysilicon |
Damien Thomas Gilmore, Azghar H Khazi-Syed, Shariq Arshad, Khanh Quang Le, Kaneez Eshaher Banu +3 more |
2023-08-29 |
| 11443879 |
Magnetic core for integrated magnetic devices |
Fuchao Wang, Yousong Zhang, Neal Murphy, Brian Zinn |
2022-09-13 |
| 11296075 |
High reliability polysilicon components |
Robert M. Higgins, Henry Litzmann Edwards, Xiaoju Wu, Shariq Arshad, Li Wang +1 more |
2022-04-05 |
| 11171035 |
Selective etches for reducing cone formation in shallow trench isolations |
Karen Hildegard Ralston Kirmse |
2021-11-09 |
| 10453738 |
Selective etches for reducing cone formation in shallow trench isolations |
Karen Hildegard Ralston Kirmse |
2019-10-22 |
| 10403424 |
Method to form magnetic core for integrated magnetic devices |
Fuchao Wang, Yousong Zhang, Neal Murphy, Brian Zinn |
2019-09-03 |
| 10090264 |
Method to improve CMP scratch resistance for non planar surfaces |
Andrew Frank Burnett, Brian Zinn |
2018-10-02 |
| 9604338 |
Method to improve CMP scratch resistance for non planar surfaces |
Andrew Frank Burnett, Brian Zinn |
2017-03-28 |
| 7351642 |
Deglaze route to compensate for film non-uniformities after STI oxide processing |
Walter Hartner, Joseph E. Page, Jr. |
2008-04-01 |
| 6927462 |
Method of forming a gate contact in a semiconductor device |
Francis Goodwin, Michael Rennie |
2005-08-09 |
| 6818534 |
DRAM having improved leakage performance and method for making same |
Stephen Rusinko |
2004-11-16 |
| 6472291 |
Planarization process to achieve improved uniformity across semiconductor wafers |
Joseph E. Page, Jr., Scott William Hill Bailey |
2002-10-29 |
| 6174787 |
Silicon corner rounding by ion implantation for shallow trench isolation |
Robert T. Fuller, Michael Rennie |
2001-01-16 |
