Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170310 | Integrated circuits including composite dielectric layer | Guruvayurappan Mathur, Abbas Ali, Poornika Fernandes, Bhaskar Srinivasan, Darrell R. Krumme +2 more | 2024-12-17 |
| 11916067 | High reliability polysilicon components | Robert M. Higgins, Henry Litzmann Edwards, Xiaoju Wu, Li Wang, Jonathan Philip Davis +1 more | 2024-02-27 |
| 11756794 | IC with deep trench polysilicon oxidation | James Tyler Overton, Divya Geetha Nair, Helen Elizabeth Melcher | 2023-09-12 |
| 11742208 | Method of reducing voids and seams in trench structures by forming semi-amorphous polysilicon | Damien Thomas Gilmore, Jonathan Philip Davis, Azghar H Khazi-Syed, Khanh Quang Le, Kaneez Eshaher Banu +3 more | 2023-08-29 |
| 11296075 | High reliability polysilicon components | Robert M. Higgins, Henry Litzmann Edwards, Xiaoju Wu, Li Wang, Jonathan Philip Davis +1 more | 2022-04-05 |
| 10243048 | High dose antimony implant through screen layer for n-type buried layer integration | Binghua Hu, Azghar H Khazi-Syed | 2019-03-26 |
| 8530298 | Radiation hardened integrated circuit | Richard Guerra Roybal, Shaoping Tang, James Fred Salzman | 2013-09-10 |