Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11929423 | Etching platinum-containing thin film using protective cap layer | Sebastian Meier, Mike Mittelstaedt | 2024-03-12 |
| 11658034 | Patterning platinum by alloying and etching platinum alloy | Sebastian Meier | 2023-05-23 |
| 11069530 | Etching platinum-containing thin film using protective cap layer | Sebastian Meier, Mike Mittelstaedt | 2021-07-20 |
| 11011381 | Patterning platinum by alloying and etching platinum alloy | Sebastian Meier | 2021-05-18 |
| 10714439 | Electronic device having cobalt coated aluminum contact pads | Nazila Dadvand | 2020-07-14 |
| 10504733 | Etching platinum-containing thin film using protective cap layer | Sebastian Meier, Mike Mittelstaedt | 2019-12-10 |
| 10297497 | Sacrificial layer for platinum patterning | Sebastian Meier, Kai-Alexander Schachtschneider, Fromund Metz, Mario Schmidpeter, Javier Gustavo Moreira | 2019-05-21 |
| 9960135 | Metal bond pad with cobalt interconnect layer and solder thereon | Gernot Manfred Bauer, ROBERT ZRILE, Kai-Alexander Schachtschneider, Michael Otte, HARALD WIESNER | 2018-05-01 |
| 9230852 | Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads | Fromund Metz, Jan Hermann Pape, Janet Riley | 2016-01-05 |
| 5080484 | Method of measuring the contact angle of wetting liquid on a solid surface | Helmut Schneider | 1992-01-14 |
| 5019205 | Apparatus for wet etching of thin films | Helmut Endl | 1991-05-28 |
| 4969973 | Method for etching an electrically conductive layer applied to a substrate | Helmut Endl | 1990-11-13 |