Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10297497 | Sacrificial layer for platinum patterning | Sebastian Meier, Helmut Rinck, Kai-Alexander Schachtschneider, Mario Schmidpeter, Javier Gustavo Moreira | 2019-05-21 |
| 9230852 | Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads | Helmut Rinck, Jan Hermann Pape, Janet Riley | 2016-01-05 |