{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for etching an electrically conductive layer applied to a substrate", "item": "https://www.patentleaderboard.com/patent/4969973"}]}
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Home › Method for etching an electrically conductive layer applied to a substrate

Method for etching an electrically conductive layer applied to a substrate

US Patent 4969973 · Granted Nov 13, 1990

Estimated economic value: $6,678,000 ⓘ

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