Issued Patents All Time
Showing 51–73 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6357112 | Method of making connection component | Thomas H. DiStefano, Joseph Fjelstad, Belgacem Haba, Owais Jamil, David Light +1 more | 2002-03-19 |
| 6274822 | Manufacture of semiconductor connection components with frangible lead sections | David Light, Belgacem Haba, Thomas H. DiStefano | 2001-08-14 |
| 6274820 | Electrical connections with deformable contacts | Thomas H. DiStefano, John W. Smith, Zlata Kovac, Joseph Fjelstad | 2001-08-14 |
| 6266874 | Methods of making microelectronic components having electrophoretically deposited layers | Thomas H. DiStefano, John W. Smith, Zlata Kovac, Joseph Fjelstad | 2001-07-31 |
| 6239386 | Electrical connections with deformable contacts | Thomas H. DiStefano, John W. Smith, Zlata Kovac, Joseph Fjelstad | 2001-05-29 |
| 6215191 | Compliant lead structures for microelectronic devices | Masud Beroz, Thomas H. DiStefano | 2001-04-10 |
| 6211572 | Semiconductor chip package with fan-in leads | Joseph Fjelstad | 2001-04-03 |
| 6204455 | Microelectronic component mounting with deformable shell terminals | Kenneth B. Gilleo | 2001-03-20 |
| 6157075 | Semiconductor assemblies with reinforced peripheral regions | Joseph Fjelstad | 2000-12-05 |
| 6086386 | Flexible connectors for microelectronic elements | Joseph Fjelstad, Thomas H. DiStefano, Anthony B. Faraci, Tan Nguyen | 2000-07-11 |
| 6012224 | Method of forming compliant microelectronic mounting device | Thomas H. DiStefano, John W. Smith, Zlata Kovac | 2000-01-11 |
| 5971253 | Microelectronic component mounting with deformable shell terminals | Kenneth B. Gilleo | 1999-10-26 |
| 5966592 | Structure and method for making a compliant lead for a microelectronic device | Masud Beroz, Thomas H. DiStefano | 1999-10-12 |
| 5966587 | Methods of making semiconductor assemblies with reinforced peripheral regions | Joseph Fjelstad | 1999-10-12 |
| 5929517 | Compliant integrated circuit package and method of fabricating the same | Thomas H. DiStefano, Craig Mitchell, John W. Smith | 1999-07-27 |
| 5821609 | Semiconductor connection component with frangible lead sections | Thomas H. DiStefano, John W. Smith, Joseph Fjelstad | 1998-10-13 |
| 5777379 | Semiconductor assemblies with reinforced peripheral regions | Joseph Fjelstad | 1998-07-07 |
| 5776796 | Method of encapsulating a semiconductor package | Thomas H. DiStefano, John W. Smith, Joseph Fjelstad, Craig Mitchell | 1998-07-07 |
| 5706174 | Compliant microelectrionic mounting device | Thomas H. DiStefano, John W. Smith, Zlata Kovac | 1998-01-06 |
| 5663106 | Method of encapsulating die and chip carrier | Thomas H. DiStefano, John W. Smith, Craig Mitchell | 1997-09-02 |
| 5629239 | Manufacture of semiconductor connection components with frangible lead sections | Thomas H. DiStefano, John W. Smith, Joseph Fjelstad | 1997-05-13 |
| 5597470 | Method for making a flexible lead for a microelectronic device | Thomas H. DiStefano, Joseph Fjelstad | 1997-01-28 |
| 5590460 | Method of making multilayer circuit | Thomas H. DiStefano, John W. Smith, Zlata Kovac, Joseph Fjelstad | 1997-01-07 |