Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6936644 | Releasable microcapsule and adhesive curing system using the same | — | 2005-08-30 |
| 6863447 | Photon-conducting media alignment using a thermokinetic material | — | 2005-03-08 |
| 6838372 | Via interconnect forming process and electronic component product thereof | — | 2005-01-04 |
| 6323062 | Wafer coating method for flip chips | David Blumel, James McLenaghan | 2001-11-27 |
| 6252301 | Compliant semiconductor chip assemblies and methods of making same | Gary W. Grube, Gaetan L. Mathieu | 2001-06-26 |
| 6228678 | Flip chip with integrated mask and underfill | David Blumel | 2001-05-08 |
| 6228681 | Flip chip having integral mask and underfill providing two-stage bump formation | David Blumel | 2001-05-08 |
| 6204455 | Microelectronic component mounting with deformable shell terminals | Konstantine Karavakis | 2001-03-20 |
| 6194788 | Flip chip with integrated flux and underfill | David Blumel | 2001-02-27 |
| 6067709 | Applying encapsulating material to substrates | Richard Godin, Steven James Corbett, Alden Johnson | 2000-05-30 |
| 6020220 | Compliant semiconductor chip assemblies and methods of making same | Gary W. Grube, Gaetan L. Mathieu | 2000-02-01 |
| 5971253 | Microelectronic component mounting with deformable shell terminals | Konstantine Karavakis | 1999-10-26 |
| 5727310 | Method of manufacturing a multilayer electronic circuit | Keith L. Casson, Carol Myers, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar | 1998-03-17 |
| 5688584 | Multilayer electronic circuit having a conductive adhesive | Keith L. Casson, Carol Myers, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar | 1997-11-18 |
| 5637176 | Methods for producing ordered Z-axis adhesive materials, materials so produced, and devices, incorporating such materials | Michael C. Corey | 1997-06-10 |
| 5531942 | Method of making electroconductive adhesive particles for Z-axis application | Michael C. Corey | 1996-07-02 |
| 5502889 | Method for electrically and mechanically connecting at least two conductive layers | Keith L. Casson, Carol Myers, Deanna Suilmann, Edward Mahagnoul, Marion Tibesar | 1996-04-02 |
| 5477611 | Method of forming interface between die and chip carrier | Jason Sweis | 1995-12-26 |
| 4747211 | Method and apparatus for preparing conductive screened through holes employing metallic plated polymer thick films | Stephen E. Chabot, Marion Tibesar | 1988-05-31 |
| 4747968 | Low temperature cure having single component conductive adhesive | — | 1988-05-31 |
| 4468425 | Boss formation using low surface energy dams | Willard H. Kreibich | 1984-08-28 |
| 4409264 | Boss formation using low surface energy dams | Willard H. Kreibich | 1983-10-11 |
| 4353858 | Method for forming a boss upon a thermoplastic polymer surface and resulting article | Willard H. Kriebich | 1982-10-12 |