| 6323062 |
Wafer coating method for flip chips |
Kenneth B. Gilleo, James McLenaghan |
2001-11-27 |
| 6228678 |
Flip chip with integrated mask and underfill |
Kenneth B. Gilleo |
2001-05-08 |
| 6228681 |
Flip chip having integral mask and underfill providing two-stage bump formation |
Kenneth B. Gilleo |
2001-05-08 |
| 6194788 |
Flip chip with integrated flux and underfill |
Kenneth B. Gilleo |
2001-02-27 |
| 5571340 |
Rosin-free, low VOC, no-clean soldering flux and method using the same |
Alvin F. Schneider, Jack Brous |
1996-11-05 |
| 5297721 |
No-clean soldering flux and method using the same |
Alvin F. Schneider, John V. Tomczak |
1994-03-29 |
| 4777111 |
Photographic element with diazo contrast enhancement layer and method of producing image in underlying photoresist layer of element |
Albert S. Deutsch |
1988-10-11 |
| 4672021 |
Contrast enhancement layer composition with naphthoquinone diazide, indicator dye and polymeric binder |
Albert S. Deutsch |
1987-06-09 |